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ASSET InterTech is the world leader in Manufacturing Test and Hardware Debug Solutions for processor-based boards.
Intel® Pentium® M
Intel® Xeon® (604 pin)
µMaster can be connected to the Unit Under Test (UUT) in a variety of ways. If the UUT doesn't have an on-board e-JTAG header, but the CPU is socketed, an interposer can be placed between the CPU and socket to provide access to the e-JTAG lines. The standard JTAG header on the interposer is then connected to the processor control POD.
Interposers are available for the following processors:
In some cases there is more than one interposer for a specific processor type, due to pin, package or core changes in later versions. For example, the Intel® Celeron® M can be based on Banias, Dothan, Yonah and Merom cores. This explains why it appears in the following interposer list a number of times. It is important to ensure that the correct interposer is selected. Please check the interposer specifications in the parts list below.
In the case of Intel® Pentium® 4 and other processors that require an Intel®-specified Debug Port Adapter (DPA), this is provided with the µMaster POD and is attached either directly to a JTAG header on the board under test, or to the header on the interposer (as shown) where no on-board header is provided.
Care should be taken when attaching the DPA: one of the pins on the header is cut off, and the corresponding hole in the DPA is blocked to ensure correct orientation.
The DPA is designed to connect to a 26-pin Intel®-specified ITP 700 header. However, adapters are available to allow the DPA to be connected to Intel®-specified ITP 700 Flex, eXtended Debug Port (XDP) and Second Side Attach (SSA) headers.
The XDP adapter (shown below) may need to be configured to ensure that the DPA receives the correct signals from the 60-pin XDP port. Please see Application Note #10 for full details.
Many recent Intel® processors, including Pentium® 4 and Xeon® processors, are designed to fit into Land Grid Array (LGA) sockets. These processors have flat pads, or lands instead of projecting pins. The LGA sockets contain pins that make contact with the processor lands. When a load plate is closed over the processor it applies a downwards force, which bends the socket pins slightly to ensure good contact. The LGA775 socket contains 775 pins (e.g. Pentium® 4) and the LGA771 contains 771 pins (e.g. Xeon®).
The LGA775 and LGA771 interposers consist of a CPU-shaped PCB that replaces the CPU in the socket on the board under test. This PCB breaks out the debug port signals onto a flexible cable, which terminates in an Intel®-specified XDP header. All other signals are passed through the PCB into a second LGA socket, in which the CPU is placed. This second socket, with the PCB soldered to its base, is loaded and depressed into the socket of the board under test by a stainless steel clamp (shown below). The heat sink and fan are mounted on top of this assembly.
This illustrated manual gives full details of the LGA interposers, and explains how to use them.
| Interposer | |
Order No. |
| Intel® Pentium® processor (PPGA) | HW777-0121 | |
| Intel® Pentium® Pro™ processor | HW777-0211 | |
| Intel® Pentium® II/III processor (Slot 1) | 4000-44412F | |
| Intel® Pentium® II/III Xeon™ processor (Slot 2) | HW444-0371 | |
| Intel® Pentium® II processor (MMC-1) | HW777-0213 | |
| Intel® Pentium® II processor (MMC-2) | HW777-0214 | |
| Intel® Pentium® III processor 1.5V FC-PGA (Coppermine, NOT Tualatin) / Intel® Celeron™ processor 2.5V PPGA & 1.5V FC-PGA (370 pin) | 4000-44492F | |
| Intel® Pentium® III processor 1.5V FC-PGA (Coppermine) & 1.25V FC-PGA (Tualatin) / Intel® Celeron™ Processor 1.5V FC-PGA ONLY (370 pin) | 4000-44492F-AGTL | |
| Mobile Intel® Pentium® III Processor-M / Mobile Intel® Celeron™ Processor (478 pin) | 4000-44772F | |
| Intel® Pentium® 4 processor FC-PGA (423 pin) | 4000-44532F | |
| Intel® Pentium® 4 / Celeron® D processors - µFC-PGA (478 pin) | 4000-44762F | |
| Mobile Intel® Pentium® 4 Processor-M (478 pin) | as above | |
| Intel® Pentium® M processor - Centrino™ / Celeron® M processors (478 pin) - Standard (header overhang on opposite side to pin 1) | 4000-44812F | |
| Intel® Pentium® M processor - Centrino™ / Celeron® M processors (478 pin) - Reversed (header overhang adjacent to pin 1, allowing access to non-standard location of CPU clamping screw) | 4000-44812F-R | |
Intel® Core™ / Core™ Solo / Core™ Duo / Core™2 Duo (A-Step) / Celeron® M processors based on the same core (478 pin). Processor pin layout viewed from below with the triangular "Pin 1" indicator at the bottom-right corner. |
4000-45154F | |
Intel® Core™2 Duo (B-Step) / Celeron® M processors based on the same core (478 pin). Processor pin layout viewed from below with the triangular "Pin 1" indicator at the bottom-right corner. |
8000-45186F | |
| Intel® Xeon® processor - Sossaman (478 pin) | 4000-45156F | |
| Intel® Xeon® processor INT-µPGA (603 pin) | 4000-44862F | |
| Intel® Xeon® processor FC-µPGA2 (604 pin) | 4000-44862F-2 | |
| Intel® Xeon® processor (including Dual- and Quad-Core) - LGA771socket (771 lands) See the LGA Interposer manual for more details |
8000-45184F | |
| Intel® FC-LGA4 processors (LGA775 - 775 lands), including Intel® Pentium® Extreme / Pentium® D / Pentium® 4 / Pentium® 4 Extreme / Celeron® D / Core™2 Duo / Core™2 Quad / Core™2 Extreme processors. See the LGA Interposer manual for more details |
8000-45182F | |
| AMD® Athlon™ / Duron™ processors | 4000-44652F | |
| Adapters | ||
| ITP 700 Flex Adapter | contact us | |
| Intel® eXtended Debug Port (XDP) Adapter (full configuration details are available in Application Note #10) | 8000-45022F | |
| Intel® Second Side Attach (SSA) Adapter | 8000-45158F |